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| T2SBA Series (SIP) 1.5-AMPERE SILICON BRIDGE RECTIFIER FEATURES * * * * Low Reverse Leakage Current Surge Overload Rating to 60A Peak Ideal for Printed Circuit Board Applications Epoxy Material - UL Recognition Flammability Classification 94V-0 Mechanical Data * * * Case: Molded Epoxy Resin Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 Polarity: Molded on Body 2542 Highlander Way ! Carrollton, TX 75006 UNIT: mm Maximum Ratings & Characteristics Single Phase, 60 Hz, Resistive or Inductive Load Ta = 25C Unless Otherwise Specified CHARACTERISTIC Peak Repetitive Reverse Voltage RMS Reverse Voltage Average Rectified Output Current @ Ta = 25C Non-Repetitive Peak Forward Surge Current 10 mS single half sine-wave superimposed on rated load Maximum Forward Voltage per Element, IF = 0.75 A Peak Reverse Current per element at VR = VRRM Operating and Storage Temperature Range SYMBOL VRRM VR(RMS) Io IFSM VF IR TJ ,Tstg T2SBA40 400 280 T2SBA60 600 420 1.5 60 1.05 10 -40 to +150 T2SBA80 800 560 UNIT V V A A V A C 972-248-2888 www.collmer.com Manufactured by Tianjin Zhong - Huan Semiconductor Co., Ltd. Rev 0, Sep 2002 T2SBA Series (SIP) Forward Voltage 10 9 8 7 6 5 4 3 2 1 0 0.4 TJ=150C TJ=25C P - Io Curve 3.5 3 2.5 P (W) 2 1.5 1 0.5 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Io (A) 2 IF (A) 0.6 0.8 VF (V) 1 1.2 Surge Forward Current 60 50 IFSM (A) Io (A) 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 Current Derating Tc at PCB Pad (3 mm) 40 30 20 10 1 10 Cycles 100 0 25 50 75 100 Tc (C) 125 150 175 In order to avoid damaging devices, please observe the following precautions: 1. When using automated soldering equipment, use 60/40 (Sn/Pb) solder (melting point of 180C) with a neutral flux similar to rosin. Preheat time should be limited to 1 - 2 minutes at 150C. 2. When using a soldering iron, use a tip temperature of less than 300C (or a soldering iron power of less than 60W). Keep the soldering time below 5 seconds. 3. After soldering, remove any flux residue to avoid corrosion. 4. Because over-voltage or over-current testing may cause permanent damage to the devices, be sure to check the test equipment for proper voltage, current and ground connection prior to beginning the test. 5. If the devices are to be encapsulated, they should be cleaned and dried at 120 5C for at least 24 hours prior to encapsulation. Test for compatibility between the device package and the encapsulation material. |
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